The technical team of the company has accumulated rich theoretical knowledge and practical experience in the fields of high-speed precision semiconductor packaging, electronic paste/plug-in high-end equipment, intelligent robot and so on, and has demonstrated successful performance in the world for more than 20 years. Has developed all kinds of epoch-making top machines/equipment, such as lead bonding machine, chip laminating machine, flip chip laminating machine, laminating machine, the world's first special-shaped component insert machine, etc.

Company technical support including enjoys high reputation in the world of the famous American university Dr/IEEE/doctoral tutor, they in the robot, visual motion control, process technology, and motor areas such as provided in the frontier and interdisciplinary theoretical guidance, simulation analysis and demonstration, research and development to lay a solid foundation for the equipment.

Design and assembly of fast and precise mechanisms

Module design and assembly of electronic assembly and inserting process

Design and assembly of high speed and accurate material transfer devices

Device architecture and integration

Vision fast, accurate positioning and intelligent detection system

Servo high speed, precise positioning and force/position control system

• Advanced Design Tools:: Computer aided design, finite element analysis, modal analysis, virtual reality and other applications;
• High speed precision machinery:Structure design, modeling and control, efficient vibration damping structure design and active/passive nonlinear compensation;
• Precision mechatronics organization:Design and analyze dynamic closed-loop systems that take into account vibration, force balance, calibration and control elements using the latest analytical and measurement tools;
• Transmission and force transfer:Determine and integrate the appropriate drive system for the motion axis to achieve maximum speed and accuracy;
• The visual system:Light path and lighting design, advanced software algorithms for alignment, placement and detection, 2D and 3D machine vision-oriented precision positioning;
• Servo system:Trajectory planning, multi-axis motion, self-adjustment and adaptive intelligent control.